H01L23/34- Arrangements for cooling, heating, ventilating or temperature compensation Temperature sensing arrangements. H01L23/00- Details of semiconductor or other solid state devices.H01L- SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10.Assignors: CAMPINI, EDOARDO, HANDLEY, WILLIAM, LEIJA, JAVIER Application granted granted Critical Publication of US7714433B2 publication Critical patent/US7714433B2/en Status Expired - Fee Related legal-status Critical Current Adjusted expiration legal-status Critical Links Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.) Filing date Publication date Application filed by Intel Corp filed Critical Intel Corp Priority to US11/716,246 priority Critical patent/US7714433B2/en Publication of US20080217764A1 publication Critical patent/US20080217764A1/en Assigned to INTEL CORPORATION reassignment INTEL CORPORATION ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Original Assignee Intel Corp Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.) ( en Inventor Edoardo Campini Javier Leija William Handley Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.) Expired - Fee Related, expires Application number US11/716,246 Other versions US20080217764A1 Google Patents Piezoelectric cooling of a semiconductor packageÄownload PDF Info Publication number US7714433B2 US7714433B2 US11/716,246 US71624607A US7714433B2 US 7714433 B2 US7714433 B2 US 7714433B2 US 71624607 A US71624607 A US 71624607A US 7714433 B2 US7714433 B2 US 7714433B2 Authority US United States Prior art keywords fan blades semiconductor device piezoelectric fan voltage Prior art date Legal status (The legal status is an assumption and is not a legal conclusion. Google Patents US7714433B2 - Piezoelectric cooling of a semiconductor package US7714433B2 - Piezoelectric cooling of a semiconductor package
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